Rigid PCB Capability:( the unit have inch and mm) | ||
Item | Mass Production | Advanced Technology |
Max. Layers | 1-16 layers | 17-30 layers |
Max. Board Size | 21"x24" ( 533mm x 610mm) | 24"x40" ( 610mm x 1016mm) |
Material | FR4,High Tg,Cem-1,Cem-3,Kapton,370HR/IS410 material,Bergquist material, Adhesiveless Base Materials,etc. | Rogers, Nelco, Telfon, etc. |
Max. Board Thickness |
2 layer - 0.125" 3.175mm 3-12 layer - 0.2362'' 6.0mm |
0.3150'' 8.0mm |
Minimum Board Thickness |
2 layer - 0.0079" 0.2mm 4 layer - 0.0177" 0.45mm 6 layer - 0.0295" 0.75mm 8 layer - 0.0413" 1.05mm 10 layer - 0.0512" 1.30mm |
|
Min. Core Thickness | 0.0039'' 0.10mm | 0.00295'' 0.075mm |
Min. Track Width/Space | 3.5mil/3.5mil | 2.5mil/2.5mil |
Max. Copper Thickness | Inner Layer: 6Oz | Inner Layer: 8Oz |
Outer Layer: 8Oz | Outer Layer:12 Oz | |
Min. Drill Size | 0.0079'' 0.2mm | 0.0059'' 0.15mm |
Min. Laser Drill Size | 0.0039'' 0.1mm | 0.0030'' 0.076mm |
PTH Diameter Tolerance | ±3mil | ±2mil |
Aspect Ratio | 10:01 | 15:01 |
PTH Wall Thickness | 18um-25um | 16um-35um |
Min solder mask bridge | 0.0051'' 0.13mm | 0.0039'' 0.1mm |
Min solder mask window | 0.0039'' 0.1mm | 0.0031'' 0.08mm |
V-cutting Tolerance | ±0.0051'' 0.13mm | ±0.0039'' 0.10mm |
Outline Dimension | ±0.0051'' 0.13mm | ±0.0039'' 0.10mm |
Warp and Twist | ≤0.7% | ≤0.5% |
Plating Hard Gold | 50” | 200” |
Controlled Impedance | ±10% | ±7% |
HDI Board | 1+N+1, 1+1+N+1+1 | 2+N+2, 3+N+3 |
Surface Treatment | HASL | HASL |
Surface Treatment | HASL Lead Free | HASL Lead Free |
Immersion Gold | Immersion Gold | |
Immersion Tin | Immersion Tin | |
Immersion Silver | Immersion Silver | |
Flash Gold | Flash Gold | |
OSP | OSP | |
Gold Finger | Gold Finger | |
Selective hard gold | Selective hard gold | |
Special Technology |
Metal Core Boards Burn-in Boards Rigid-Flex Boards Flex Boards Micro Circuits Blind & Buried Vias Laser Drilled Vias Mechanically Drilled Micro Vias |
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